{"as_of":"2026-09-29","lane":"Custom AI Silicon Enablement","taxonomy":["Design_Services_Spec_Handoff","Interconnect_And_IP","Substrates_And_Packaging","Verification_And_Test"],"records":[{"id":"semifive-asic","date":"2026-09-29","company":"SEMIFIVE","title":"U.S. inference ASIC development contract","categories":["compute","ai interconnect","capacity reservation","custom ai silicon enablement","design services spec handoff","interconnect and ip"],"status":"announced contract","fact":"SEMIFIVE announced an approximately $52 million spec hand-off development contract for a U.S. fabless customer’s data-center inference ASIC using planned LPDDR6, PCIe Gen5 and a large-die architecture.","unknowns":"The customer is undisclosed. H1 2027 tape-out and 2028 mass production are targets, not completed milestones. The exact die area, process node, foundry reservation, IP licenses and NRE revenue recognized on this award are not disclosed.","verify":"Track NRE recognized by period, tape-out slips, foundry slot evidence, qualified LPDDR6 and PCIe IP, packaging, first silicon, customer acceptance and production revenue separately.","source_url":"https://www.prnewswire.com/news-releases/semifive-secures-usd-52-million-ai-accelerator-contract-with-us-fabless-company-validating-end-to-end-asic-model-in-north-america-302892224.html","source_label":"Company release","supplier_classes":["Design services / spec hand-off","Interconnect and interface IP","Substrates and packaging","Verification and test"],"silicon":{"deal_type":"Spec_Handoff","contract_usd_m_approx":52,"customer_tier":"US fabless (undisclosed)","nre_recognized_usd_m":null,"design_win_status":"announced","tapeout_target":"H1 2027","tapeout_actual":null,"production_target":"2028","production_actual":null,"production_revenue_usd_m":null,"process_node_nm":null,"foundry_slot_status":"not disclosed","die_area_mm2":null,"large_die_planned":true,"chiplets":null,"interfaces":["LPDDR6","PCIe Gen5"],"ip_license_events":[],"hyperscaler_direct_customer_verified":false,"taxonomy":["Design_Services_Spec_Handoff","Interconnect_And_IP","Substrates_And_Packaging","Verification_And_Test"],"milestone_status":"contracted"},"paxton_custom_silicon_score":{"value":56,"components":{"design_wins":30,"conversion":8,"customer_exposure":5,"architecture":13},"scale":100,"algorithm_version":"custom-silicon-1","kind":"disclosure and milestone evidence; not a valuation"},"early_indicators":{"nre_recognized_usd_m":null,"foundry_slot_status":"not disclosed","ip_license_events":[],"tapeout_target":"H1 2027","tapeout_actual":null,"production_target":"2028","production_actual":null}}]}