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Advanced packaging determines how many logic dies and HBM stacks can become a finished AI accelerator, making CoWoS capacity as important as wafer capacity.
Delivering steady power to an AI accelerator is a major engineering task. Here is how voltage regulation and power delivery work, from the rack down to...
Logic transistors keep getting denser, but the fast SRAM memory built into chips has not kept pace. Here is why, and how designers are responding.
AI accelerators concentrate a lot of power in a small area. Here is why heat density matters, how heat leaves a chip and what that means...
Most chips are cut from wafers in many small pieces. Some designs keep the whole wafer as one giant processor. Here is how wafer-scale chips work...
Chipmaking depends on a long list of ultra-pure materials, gases and chemicals. Here is an overview of the key inputs and why their supply matters.
As AI clusters grow, copper wires struggle to keep up. Here is how optical connections and silicon photonics work, and why they are getting so much...
A semiconductor fab is filled with specialized machines, each handling one kind of step. Here is a tour of the main tool categories and what they...
When a language model generates text, it stores a running memory of the conversation called the KV cache. Here is why it can rival the model...
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